去年的OCP EMEA区域峰会
是在布拉格举办,今年在葡萄牙首都里斯本,都是好地方。
2024 OCP EMEA Regional Summit演讲资料网盘分享
https://pan.baidu.com/s/16-xJortO22crHVWd91KYbA?pwd=18qd
提取码:18qd
官网来源 https://www.opencompute.org/events/past-events/2024-emea-regional-summit(内含视频链接,qiang外的)
附:部分往届峰会资料
《
2023 OCP Global Summit会议资料分享
》
《
2022 OCP Global Summit会议资料分享
》
《
2021 OCP Global Summit会议资料下载分享
》
《
2019 OCP Global Summit会议资料下载 - Part 3
》
《
2019 OCP Global Summit会议资料下载 - Part 1
》
《
OCP 2018峰会资料下载:互联网数据中心硬件风向标
》
本次议题如下:
Keynotes
2024 OCP EMEA
Regional Summit - All Keynotes
|
OCP Intro Video
|
Welcome to the
2024 OCP Regional Summit
|
Enabling Collaboration
for Innovation & Foundation Innovation Update
|
Cloud
Environmental Impact: OVHcloud’s Positioning and Solutions
|
Transforming the
Data Center - Scaling Computing Infrastructure Sustainably
|
Bringing AI
Everywhere - Presented by Intel
|
PANEL - The role
of startups and VC in the OCP Ecosystem
|
The EUPILOT:
Europe’s OCP-Based HPC and AI pre-exascale accelerator demonstrator
|
Stranded Capacity
in Data Centers is Costing the Earth
|
PANEL -
De-Mystifying European Sustainability Directives
|
Trusted Cloud:
Journey of Open Hardware Innovation - Presented by Microsoft
|
AI for All: Path
towards an open AI Infrastructure - Presented by Meta
|
Executive Session
AI adoption and
the challenges to develop and scale real world hardware - presented by Rittal
GmbH & Co. KG
|
Direct-to-Chip
Liquid Cooling AI Cluster Architectures Inspired by OCP Principles and
Technologies - presented by Supermicro
|
Enabling
Sustainability, Scalability and Security via Platform Firmware - presented by
AMI
|
Quantum Journey of
Open Hardware Innovation - Presented by Microsoft
|
Real-Life OCP
Deployments and Migrations - presented by Circle B
|
Scaling Systems
for Gen AI - presented by Intel
|
Future Technologies Symposium
Air or liquid
cooled servers – the right product for the right place!
|
Analog In-memory
computing with multilevel memristive devices for high performance computing
|
Breaking the
barrier, chip level cooling up to and beyond 1000W in single phase dielectric
fluid
|
Ceramic Nano
Memory enabling the AI Storage Dataverse
|
Chiplet-Based
Compressed LLC Cache & Memory Expansion
|
Delivering
Performant AI Solutions
|
Direct-to-chip,
Two-Phase Cooling Performance Metrics and PFAS Sustainability
|
FTS Announcement
|
FTS Wrap-up
|
Large Memory
Server Design Overview
|
Novel Power
Optimization Methods for AI/HPC Chips: Workload-Aware Adaptive Voltage
Scaling
|
OCP FTS Welcome
and Kickoff
|
Silicon Dreams:
Toward the AI Singularity
|
如果把32个E3.S前置位换成OMI内存,OpenPOWER这么玩还有前途吗?
SONiC Workshop (hosted by Stordis)
Connectivity as
Software
|
Disaggregated
white box with community SONiC: barriers and solutions towards
deployment-readiness
|
Driving
Performance: Efficient Networking for AI Infrastructure
|
Migrating to SONiC
Fabrics: from Campus Networks to Telco Edge Solutions
|
Migration from
Cumulus to SONiC at metal-stack.io
|
Open Networking in
the Sovereign Cloud Stack Project
|
Pioneering Open
Networking with STORDIS: Harnessing Open Sources for SONiC, Monsoon, and
AI-Enhanced ORCA
|
Simple & Smart
Configuration using GIT for Mid-sized Companies
|
SONiC Bootcamp
Greetings and Introduction
|
SONiC Distribution
Freedom
|
SONiC is coming to
the Enterprise
|
The Final Link:
Wrapping Up and Looking Ahead with SONiC
|
Artificial Intelligence (AI)
Artificial
Intelligence (AI) Track Kickoff
|
Chiplets for
generative AI
|
CXL Solutions for
Key AI Problems
|
Harnessing the
Power of AI/ML to Enhance SAI Testing
|
NVIDIA Spectrum-X
Network Platform Architecture
|
Optcast:
Open-Source Aggregation Offloading for Distributed Deep Learning
|
Q&A:
Economically Viable System Architectures for AI
|
Q&A:
Networking for AI Workloads: Opportunities and Challenges
|
Scheduled Ethernet
Fabric for Large scale AI training cluster
|
The Case for
Computational Offload to CXL Memory Devices for AI Workloads
|
DC Sustainability
A Holistic
Approach to Carbon Modelling of Emission Scopes 1, 2, 3 and 4 Integrating BIM
in Decision Making for Start Campus’ Net Zero Mission
|
Accelerating the
Development and Implementation of Low-Carbon Concrete for Data Center
Construction
|
Addressing Carbon
Emission Quantification Challenges in Hardware Manufacturing and Datacenter
Operations
|
Challenges of live
environmental footprint reporting
|
DC Facility
Sustainability Project Status Updates
|
Efficiency 101:
Data Centers' Guide to the New European Regulations
|
Energy-Aware
Workload Orchestration on OCP Servers using Kubernetes
|
Enhancing
Telecommunications for the Future: Integrating Sustainability and Efficiency
into Central Offices
|
Increasing Energy
Efficiency of Server Cooling Over Traditional Methods with a Deep
Reinforcement Learning Agents running on an OCP Compliant BMC platforms
|
Leveling the
Playing Field: Industry Standard Benchmarks and OCP
|
Life Cycle
Assessment of the Open Rack 3, Steel vs. CLT models
|
Lifecycle analysis
on servers – going from servers to components to precious metals
|
Measuring Carbon
Emissions in Cloud Environments - An Introduction to the ECO:DIGIT project
|
Net Zero
Innovation Hub
|
OCP underground
hyperscalers enables compliance of Energy Efficiency Act
|
PANEL: iMason Climate
Accord & OCP: Carbon Disclosure Project Update
|
Participating in
an Open Hardware Ecosystem
|
Sustainability
Metrics - Infrastructure Utilization Efficiency (IUE) considerations
|
Telemetry enhanced
green coding – how detailed telemetry can contribute to sustainability goals
|
The creation of a
circular economy-based cloud service: New key takeaways and lessons learned
|
这里的欧盟不包括英国
EMEA Deployments
A Practical Guide
to Disaggregated Networking: IP Infusion, Madeo and Prosoluce Present the
Keys to Success
|
Automating the
Migration Journey to Open-Standards Networks
|
Building a
sustainable management infrastructure with open source firmware
|
Coherent Optics :
Why they don't just work in my switch
|
Empowering Cloud
Sovereignty: Building a Resilient Open Cloud Ecosystem in Germany
|
How alternative
materials can address industry challenges? The Universal Quick Disconnects
case in liquid cooling.
|
How Innovative
Open Networking helps improve day to day business in a Large Public
University
|
OCP Ready™ for
Hyperscale v2: Aligning the Industry on data center requirements for
hyperscaler deployments
|
Scaling Down While
Scaling Up – Design Choices That Increase Efficiency & Performance
|
Steve Helvie (VP
of Emerging Markets for OCP) - How Europe is viewing the OCP Marketplace
|
Power and Cooling
Adopting Best
Practices: Warranty Guidelines for Immersion Cooled Computing
|
CE Cold Plate
Subproject Overview
|
Cooling
Environments Project Overview & Roadmap for a Durable Chip Coolant
Temperature
|
DC-Power: Using
medium voltage DC grids to reduce data center losses
|
Dielectric Cold
Plate based Modular Data Center
|
Door Heat
Exchanger Requirements for Open Rack
|
Heat reuse
subproject - Policies + Economics Workstreams + Reference designs
|
Integrating Power
Delivery in Immersion Tanks: Challenges and Opportunities
|
Integrating
Standards and Economics: Shaping the Future of Immersion Cooling
|
Liquid Cooling
Bazaar
|
Navigating the
Evolution and Challenges of OCP Immersion Cooling
|
Novel Hybrid
Immersion Liquid Cooling Technique for Data Center
|
OCP Modular Data
Center Working Group Update
|
OCP Orv3 Blind
Mate Liquid Cooling Overview and Updates
|
Optimizing Signal
Integrity in Immersion-Cooled IT Platforms
|
ORv3 High Power
Rack (HPR) Ecosystem Solution
|
Panel:
Past-Present-Future of heat reuse
|
Requirements/Considerations
of Next Generation ORv3 PSU and Power Shelves
|
Safe Handling
Guidelines for Immersion Fluids
|
Single phase
immersion cooling developments – Research Institutes of Sweden OCP Experience
Center working with Castrol
|
Sustainable
Innovations in Immersion Cooling: Fluids, Materials, and Lifecycle Management
|
冷板与浸没液冷的混合?
Security and Data Protection
Adam’s Bridge
Accelerator
|
Attested TLS and
formalization
|
Empowering
Firmware Security: The Indispensable Role of SBOM for End Users
|
OCP Flashless Boot
Update
|
OCP L.O.C.K.
|
OCP S.A.F.E.
Update
|
Project Caliptra
Update
|
Providing
certifiable secure hardware subsystems with anti-tamper mechanisms
|
Recent and
Upcoming Security Trends in Cloud Low-level Hardware Devices: A Survey
|
Recovery from
firmware vulnerabilities in TPM
|
Sustainable Scalable Computational Infrastructure
Assured PNT for
Data Centers, All you need to know
|
Chiplet based
Reconfigurable OCP Accelerator Module (OAM) architecture and platform
|
Data Center Life
Cycle Manageability @ Scale
|
Data Center
Modular Hardware System Specification (DC-MHS) the overview
|
DC-MHS Modular
Shared Infrastructure (M-SIF)
|
Hardening GNSS
Time - A Method to Counter Spoofing Attacks
|
Leveraging OCP to
Create a Purpose Built ARM Processor
|
OCP Composable
Memory Systems (CMS) Sub-Project progress update and plans
|
OpenLAN
cloud-managed Switches running open-source SONiC
|
PCIe Add-In-Cards
(CXL, NIC) Out-Of-Band manageability in Data Centers
|
PCIe Express
corrected errors handling (RAS) solution implementation considerations in
Meta's AI/ML Training Clusters
|
Power at all
costs?
|
Progress towards
an Open & Sustainable, Energy Centric Computing Architecture for today’s
AI & HPC Applications
|
Sensor Discovery
and Manageability for Pluggable DC-MHS Designs
|
Streamlining CXL
Adoption for Hyperscale Efficiency
|
Why chiplet will
transform the semiconductor ecosystem from design to packaging?
|
注意:
上
图中的OAM CMM是CXL内存模块哦。
Special Focus: OpenRAN
5G Open RAN and
Edge Deployments in Europe
|
5G Open RAN
ecosystem in India
|
Building the
OpenRAN edge cloud with open hardware including open radio
|
CapGemini view of
OpenRAN and potential for an Open Radio Platform
|
ETSI Activities
Supporting OpenRAN and Open Radio Platform
|
i14Y role in
OpenRAN and potential for an Open Radio Platform
|
Manufacturing
Carrier Grade Radios
|
OCP Evenstar
Project Update
|
OpenRAN Challenges
and Opportunities for NOS
|
OpenRAN Market
Overview and Strategies
|
Panel: Breaking
Down Barriers to OpenRAN
|
Special Focus: Optics for AI Clusters
Advancements in
Linear Drive Pluggable Optics for High-Speed Data Interconnects
|
Augmented Silicon
Photonics for Data Center and AI/ML optical interconnects
|
Chip-scale Laser
Combs for Connectivity of AI Custers
|
Coherent Optics
for Artificial Intelligence
|
Market Overview
|
Optical CXL for
disaggregated compute architectures
|
Optics in AI
Clusters - Meta Perspective
|
PANEL: The
evolving role of optics in AI Clusters
|
Re-configurable
Photonic Interconnects for AI/ML Infrastructure
|
Technology Case
Study
|
Wrap Up Comments
|
Special Focus: Quantum
A Blueprint for
Quantum Networking
|
Emerging Quantum
Standards
|
Practicality of
Deploying and Managing Quantum Networks
|
Quantum Computers
& Simulators in HPC Centres
|
Quantum Computing
for Life Science Simulations and Optimizations
|
Quantum
Empowerment: Navigating the Quantum Revolution for Businesses
|
Quantum Error
Correction
|
Quantum Technology
Overview (Computing and Communications)
|
Scaling the
Quantum Computer
|
Self-certification
for entropy generation
|
The Bridge
Accelerator
|
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