14th China International Forum on Solid State Lighting (SSLCHINA 2017)
Call for Papers
http://www.sslchina.org/
China International Forum on Solid State Lighting （SSLCHINA）is a global high level forum sponsored by China Solid State Lighting Alliance (CSA) aiming at promoting the international exchange and cooperation of semiconductor lighting technology and application and lead the development direction for the emerging semiconductor lighting industry, comprehensively cover innovative development of technology and equipment, raw materials, epitaxial chip，packaging， products and applications of the industry, provide the whole industry chain cooperation platform on a worldwide scale, and commit to expand the target market concerned by the industry.
GENERAL CHAIRS
Yoshi OHNO
-- NIST fellow, President of CIE
CAO Jianlin
--President of International Solid State Lighting Aliiance, Ex-Vice Minister of The Ministry of Science and TechnologyProgram Committee
Tech Chair
JIANG Fengyi
--Vice President of Nanchang University
Tech Co-Chairs
LUO Ming/Ronnier LUO
--Professor at Department of Optical Engineering, Zhejiang University
Jay LIU
--Executive Vice President & CTO of ShineOn (Beijing) Technology
WANG Junxi
--Professor at Semiconductor Institute of Chinese Academy of Sciences; Vice Director of Research and Development Center for Semiconductor Lighting Chinese Academy of Sciences
ZHANG Junming
--Professor at Zhejiang University; Deputy Dean of Power Electronics Research Institute
YANG Qichang
--Professor & Director at Institute of Environment and Sustainable Development in Aguriculture, CAAS
QU Jia
--Dean and Professor at Eye Hospital of WMU Zhejiang Eye Hospital
LIAO Liangsheng
--Professor at Soochow University
ZHAO Lixia
--Professor at Semiconductor Institute of Chinese Academy of Sciences
MOU Tongsheng
--Professor at Zhejiang University
CHEN Zhen
--Standing Deputy GM of Lattice Power (Jiangxi) Corporation
HOST
•China Solid State Lighting Alliance (CSA)
•Zhongguancun Science Park Shunyi Park Management Committee
SUPPORTERS
•Department of High and New Technology Development and Industrialization, Ministry of Science and Technology
•Department of Western Development, National Development and Reform Commission
•Department of Resource Conservation and Environmental Protection, National Development and Reform Commission
•Industrial Standards Department Ⅱ of Standardization Administration of the People's Republic of China (SAC)
•Science and Technology Commission of Beijing Municipality
ORGANIZERS
Beijing Solid State Lighting S&T Promotion Center
Beijing MKQ New Material Productivity promotion Center
China Solid State Lighting Online (www.china-led.org)
The forum has a long-term cooperation with the IEEE. High quality papers contributed to SSLCHINA will be published in the Xplore IEEE electronic library after selection.
CONTENTS
P201: Materials and Equipment Technologies
LED general lighting has entered into the critical period of large-scale outbreak. It is still very important to further improve the luminous efficiency of LED and reduce the preparation cost of LED. At present, LED still has a large room to improve in the areas of epitaxial method, energy conversion efficiency, thermal energy management, production equipment and process control. Materials and equipment technology is essential to improve the cost-performance ratio of LED, and drives the development of LED lighting market.
Scope
:
• Solid State Lighting Related Substrate Material
• Nitride Epitaxial Technology
• Epitaxial and Substrate Related Equipment Technology
• Testing Technology and Equipment
• New Material Technology(eg. Graphene, Oxide, Boron Nitride, etc.)
• Material Process Control and Cost Management
Sub-forum Chair:
WANG Junxi-
-Professor at Semiconductor Institute of Chinese Academy of Sciences; Vice Director of Research and Development Center for Semiconductor Lighting Chinese Academy of Sciences
Sub-forum Members:
XU Bingshe
--Vice President and Professor of Taiyuan University of Technology
ZHANG Baijun
--Professor at Sun Yat-Sen University
GUO Xia
--Professor at Beijing University of Posts and Telecommunications
LI Dabing
--Professor at Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences
BI Wengang
--Professor at Hebei University of Technology
P202: Technologies for Chip, Packaging and Modules
The rapid development of white LED in the past ten years has been focusing on light efficiency and cost. Under the environment of new economy and new driving forces in 13th Five Year Plan, what are the development opportunities for LED industry? What are the latest development of manufacturing technology of chip and package? Flip chip LED into the mature period, its performance advantage and price adjustment affects not only the market trend of chip, but also the technology trend of package and module. The wide application of flip chip promotes the technological revolution of chip scale package (CSP) and FC-COB with high power and high light density, changes the situation that traditional package stents and high power ceramic package occupy important position. Recently GaN on Si based LED won the National Science and Technology Invention Award, become a hot topic in the industry again, how does it change market prospects of chip and packaging applications?
What is the latest progress and development tendency of technologies, such as LED chip process, package material, fluorescent powder coating, lens design, wafer level package and integrated optical engine driven by high voltage AC (DOB)? What role do these technologies play in the industrial structure change in the future? Please pay attention to the latest development of chip, package and module technology.
Scope
:
•
New Progress of LED Chip Manufacturing Technologies
•
High Efficient UV, Blue, Green and Red Chip Technology
•
Mounted Chips, Flip Chip and Vertical Chip Technology
•
Latest Development of LED Packaging Materials (Substrate, Solid Crystal Materials, Silica Gel, Fluorescent Powder, etc.)
•
Fluorescent Powder, Quantum Dot Technology and Coating Technology
•
Lens Design and Optic Module
•
Chip level and Wafer Level Packaging Technology
•
Multi-chip Packaging, Design and Optimization of COB
•
New Development of Light Source with High Quality and Full Spectrum
•
Advanced Packaging Technology and Manufacturing Technology with High Sigma and Low Color Tolerance
•
The New Generation of LED Light Source and Light Engine
Sub-forum Chair:
Jay LIU
--Executive Vice President & CTO of ShineOn (Beijing) Technology
Sub-forum Members:
YI Xiaoyan
--Professor at Semiconductor Institute, Chinese Academy of Sciences
JIN Peng
--Associate Professor at Green Lighting Laboratory, Peking University
YUN Feng
--Professor at Xi'an Jiaotong University
GUO Weiling
--Professor at Beijing University of Technology
MO Qingwei
--Deputy Director of Elec-Tech International
P203: Technologies for Reliability and Thermal Management
Technologies for reliability and thermal management has always been an important factor restricting the quality of LED lighting, and now the concerns on the reliability of a single LED product has changed to the reliability of entire system. In the process, reliability of the whole system will be affected by advances in technologies such as novel materials for heat dissipation, thermal management technology, research and design for reliability of LED lighting system, fault data and failure analysis, control and reliability screening in manufacturing process, accelerated life testing method, failure mode and simulation etc.
Scope:
•
Novel Materials for Heat Dissipation
•
Thermal Management Technologies
•
Research and Design for Reliability of LED Lighting System
•
Fault Diagnosis and Prediction
•
Failure Detection and Failure Analysis
•
Accelerated Life Testing and Prediction Methods
•
Failure Mode and Simulation
•
Control and Reliability Screening in Manufacturing Process
Sub-forum Chairs:
ZHAO Lixia
--Professor at Semiconductor Institute of Chinese Academy of Sciences
Gordon ELGER-
-Professor at Technische Hochschule Ingolstadt，Germany
Sub-forum Members:
YANG Daoguo
--Professor and the Dean at School of Mechanical and Electrical Engineering， Guilin University of Electronic Technology
LUO Xiaobing
--Professor at Huazhong University of Science and Technology
P204: Driver, Intelligence and Control Technologies
Intelligent lighting products has been gradually integrated into the smart home system; Intellectualization, digitalization and controllability are leading the development trend for future LED lighting industry, from constantly improving and extending the life of driver circuit to keep pace with longer LED life, to gradually making progress in intelligent lighting. There are some important topics, such as thermal management and high performance driving scheme, new driving circuit and IC, LED dimming and color temperature technology, solution for controlling lighting products, wireless control technology, intelligent LED lighting and new Interconnect technology, intelligent LED lighting system and sensor technology etc.
Scope:
•
Power Management and High Efficiency Driving Solutions
•
IC New Drive Circuit and Integrated IC
•
LED Dimming and Modulating Color Temperature Techniques
•
Solution for Controlling Lighting Product
•
Wireless Communications (ZigBee, Bluetooth, Wifi, Thread, etc.)
•
Visible Light Communication Technologies and Applications (Lifi, etc.)
•
Integration Of Intelligent Lighting and Smart Home System
•
New Interconnection Technologies
•
Intelligent LED Lighting System and Sensor Technology
•
Modularization and Standardization of Drives
•
Network Intelligent Lighting and POE Lighting TechnologiesSub-forum
Sub-forum Chairs:
ZHANG Junming
--Professor at Zhejiang University, Deputy Dean of Power Electronics Research Institute
SONG Hongwei
--Professor at Zhejiang University, President of Zhejiang Fonda Technology Co.,Ltd.
Sub-forum Members:
Mike YANG
